SODIMM / MiniDIMM
Virtium has a proven history of small form factor product development, which is demonstrated with our long list of first-to-market SODIMM and MiniDIMM modules. Virtium was the first company to introduce ECC SODIMM and SO-RDIMM products in 2006. Virtium’s ECC SODIMM modules have also been proven on high-volume MicroServer platforms and have been validated by Intel®. This enables more mainstream applications to realize the advantages of ECC on a lower cost, smaller form factor module.
In 2010, Virtium introduced the first 4GB DDR3 ECC unbuffered MiniDIMM (Mini-UDIMM) in the Ultra-Low Profile (ULP) form factor. The company was also first to market with ECC SODIMM, SO-RDIMM and VLP DIMM products.
This extensive engineering expertise enables Virtium to deliver small form factor memory in the highest density, lowest profile and smallest form factors possible. Solving customers’ application requirements, Virtium has applied patented design and component stacking techniques to improve system reliability and increase MTBF.
Virtium also offers advanced small form factor ruggedized features such as thermal heat spreaders, conformal coating, thermal sensors and under fill. This technology enables our memory modules to withstand the industrial temperature, shock and vibration requirements of many embedded systems.
|Virtium SODIMM/MiniDIMM Memory Modules||Technical Information|
|Technology1||DDR3, DDR2, DDR, SDRAM|
|Registered||Available on SODIMM/MiniDIMM form factors|
|Unbuffered||Available on SODIMM/MiniDIMM form factors|
|ECC2||Available on all form factors|
|Height||Standard, VLP, ULP|
|Density (GB)||1, 2, 4, 8, 16|
|Speed||Available up to PC3-12800; PC2-6400; PC3200; PC133|
|Rank||1, 2, 4|
|Standard Temperature||0°C to 85°C|
|Extended and Industrial Temperature||-25°C to 95°C and -40°C to 95°C|
2: SODIMM offered in non-ECC configuration