SODIMM / Mini-DIMM
Virtium has a proven history of small form factor (SFF) memory module product development, which is demonstrated with our long list of first-to-market SO-DIMM and Mini-DIMM new technology form factors. Virtium was the first company to introduce ECC SODIMM products and SORDIMM in 2006. In 2010, Virtium introduced the first 4GB DDR3 ECC UNBUFFERED MiniDIMM in advanced Ultra-Low Profile (ULP) 17.78mm (.700 inch) form factor. The company was also first to market with ECC SODIMM, SORDIMM and VLP DIMM products.
This extensive engineering expertise enables Virtium to deliver small form factor memory in the highest density, lowest profile or smallest form factors possible. Solving customers’ application requirements, Virtium has applied novel layout techniques such as reducing its module design’s overall thickness or applying stacking techniques that decrease module height to facilitate greater airflow through the components and the system, improving system reliability and increasing Mean Time between Failure (MTBF).
Virtium also offers advanced small form factor ruggedized features such as Thermal Heat Spreaders and temperature screening to Industrial Extended Temperatures of -40°C to +85°C or beyond. Conformal coatings, thermal sensors, and under-fills are also available on Virtium memory modules.
Virtium is committed to serving customers with leading-edge, first-to-market products and it is frequently the last company supporting legacy memory products. Virtium’s product strategy allows embedded computing OEMs to confidently design-in high capacity products with the assurance that Virtium will provide full lifecycle memory module support in small form factors such as SO-DIMM and Mini-DIMM.
Review specific Virtium SO-DIMM / Mini-DIMM product specification at:
Link to SO-DIMM / Mini-DIMM Datasheet
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