Virtium’s has a proven history of small form factor (SFF) memory module product development, which is demonstrated with our long list of first-to-market SO-DIMM and Mini-DIMM new technology form factors. Virtium was the first company to introduce ECC SO-DIMM products and SO-RDIMM in 2006. In 2010, Virtium introduced the first 4GB DDR3 ECC UNBUFFERED Mini-DIMM designed in our advanced Ultra-Low Profile (ULP) 17.78mm (.700 inch) form factor.                                                                                                 Read more

Virtium is a leading developer of Very Low Profile (VLP) memory modules for space-constrained applications. Offering modules with a height of only 0.72 inches in the VLP form factor, and 0.70 inches in Virtium’s Ultra-Low Profile (ULP) form factor, Virtium VLP modules meet the demand for increased airflow in tight spaces. Both Mini-DIMM and SO-DIMM modules are available in VLP form factors that support a variety of advanced DDR2 and DDR3 generation features.                                                                                             Read more

Virtium works with customers to define the test parameters, test equipment and testing time needed for all extended temperature screening ranges. Once a joint definition is established after validation based on the customer’s application environment, 100% of the product produced at Virtium will be tested accordingly to this defined plan. Extended temperature products are also production tested on Temptronic Thermalstream Units using our customers’ motherboard, or an approved motherboard that has an identical chipset and setup, and the test is performed with a memory diagnostic program at true speeds.                                                                                                          Read more

Virtium offers a variety of enhanced ruggedization options in addition to our high reliability processes for our standard memory modules. These module options help OEMs meet their additional requirements for further protection against vibration, temperature extremes, or other harsh environmental conditions.
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