Stacked Chips/TwinRAM
Virtium’s patented chip stacking technologies provide OEMs with many benefits including:
- Reduced module costs
- Quicker lead times
- High quality, automated manufacturing
- Superior TwinRAM x16 sub-modules
Utilizing our sophisticated BGA and TSOP chip stacking technologies as well as flash stacked components, Virtium leverages the advantages of lower cost components and quicker integration times while maintaining the functionality of lower volume specialty DRAM configurations. Virtium reduces the cost of sourcing hard to find configurations and densities by using high-volume products in stacked configurations to reduce the height of Low Profile DIMM, VLP DIMM and VLP SODIMM applications. The use of mainstream DRAM enables Virtium to offer its customers shorter lead times when supply is tight or on allocation.
Virtium’s precision stacking technologies are automated and manufacturing-friendly, which results in product consistency and high reliability. An example of Virtium’s advanced manufacturing capabilities is its TwinRAM that features two x8 DRAM components on a sub-carrier form factor. The Virtium TwinRAM delivers the functionality of hard to source x16 components at a significantly reduced cost. TwinRAM is designed for direct attachment to motherboards through standard reflow techniques.
To find out more about Virtium’s stacked chip-based products, please go to:
Link to Stacked Chip/TWIN RAM Product Datasheet
|
|
||||||||||||||
