Stacked Chips/TwinRAM

Utilizing our sophisticated BGA and TSOP chip stacking technologies, Virtium leverages the advantages of lower cost component integration that is able to maintain the functionality of lower volume specialty DRAM configurations. Virtium reduces the cost of sourcing hard to find configurations and densities by using high-volume products in stacked configurations. The use of mainstream DRAM enables Virtium to offer its customers shorter lead times when supply is tight or on allocation.                                                                                                  Read more