Virtium’s Low Power 8GB VLP DDR3 Registered Mini DIMM (VLP RDIMM) Industrial Memory module is designed for low power consumption Embedded and Telecommunications applications.

8GB VLP DDR3 Registered MiniDIMM expands Virtium’s VLP DIMM (Very Low Profile DIMM) Industrial memory product line.

 

Rancho Santa Margarita, CA (October 28, 2011) Virtium Technology, Inc., a solutions-driven designer and manufacturer of Industrial Memory and Flash Storage Solutions for Embedded and Telecommunication OEMs announced today its new and highly reliable 8GB VLP DDR3 Registered Mini DIMM module featured with low power (1.37v) design. Virtium’s VLP DIMM Module utilizes state of the art technology which enables applications and systems to achieve consistently higher levels of performance with significant benefits in power consumption, space requirements and product life cycle durability compared to other industrial memory or low profile DIMM Modules.

The high density design of the new 1.35v module allows engineers and application designers to reduce total system operating costs associated with power requirements, while significantly improving the system capacity. These benefits are particularly important to OEMs complying with the U.S. Environmental Protection Agency’s (EPA Agency) Energy Star Initiative energy saving requirements for data center AdvancedTCA Blades, Ethernet switches and routers.

Additional product enhancements for the DDR3 Mini-RDIMM include:

• Availability of Thermal Heat-Spreaders
•  Industrial Temperature Screening of -40C to +85C
• Conformal Coating
• Under-Fill Protection with Thermal Sensor
• ZQ Calibration Support
• Fast Data Transfer Rates
• Very Low Profile Module (18.29mm) PCB Height
• ECC Error Detection / Correction Support
• Nominal & Dynamic On-Die Termination (ODT)
• Bi-Directional differential data-strobe
• Eight internal Component Banks (Concurrent Operation)

The VLP RDIMM (Very Low Profile Memory) PCB design is paramount in meeting the minimal space and high performance requirements present in today’s leading Embedded and Telecommunications Applications. The standardized VLP minidimm module height of 18.29mm makes the DDR3 Mini RDIMM an ideal industrial memory solution for mounting into a connector socket or edge mount for ultimate space savings in industrial OEM applications. 

“We are excited to deliver this high density module in the VLP Mini-DIMM with up to 8GB dual rank. This high density, low power, low profile memory module design was based on Virtium’s advanced component technology and testing”, said Phan Hoang, V.P of Research and Development at Virtium. “With this high density and low power module, it provides significant advantage with respect to time-to-market and readiness for next generation OS such as windows 8.”