In our March newsletter, we indicated that DRAM prices were predicted to increase due to a variety of factors. March and April saw the DRAM spot price increase 15% to 20%. We also expect DRAM lead times will become longer in the upcoming months and into Q3, due to the same factors driving price increases and what is predicted to be a strong seasonal demand for DRAM memory modules needed for new computers being built for back-to-school and holiday end-of-year purchases.If the aggregate demand continues to surpass the DRAM aggregate supply, DDR2 component inventory levels will decline making it difficult to acquire generally and particularly within standard lead times. This could result in a strong DDR2/DDR3 1Gb upward pricing trend for Q3, with spot prices remaining strong and “above-contract-price” along with potential shortages.

According to DRAMeXchange.com, given the aggressive demand from PC-OEMs during the 1st half of 2010, DRAM contract prices have strong upward momentum. DRAM vendors are still working on technology migrations and the strong demand for mobile DRAM has cannibalized the output from commodity DRAM. This further resulted in the limited supply for components.

Virtium will continue to conduct Pricing Roadmap Reviews with our customers to keep them abreast of the expected changes in DRAM pricing and availability. Please contact us to allow us to satisfy your memory needs.
Please contact us to allow us to satisfy your memory needs.

DDR3 MicroDIMM

 

Virtium Technology now offers ruggedized DDR3 MicroDIMMs that are 20-25% smaller than standard SODIMMs with a mechanical outline of only 54mm wide x 30mm tall. These ruggedized industrial MicroDIMMs are operational in the industrial temperature range of -40°C to +85°C and are available in 1GB, 2GB and 4GB densities at speeds up to PC3-10600 and come with a variety of optional features to meet most MicroDIMM requirements. Virtium MicroDIMM enhancements include, ECC and Non-ECC options, connector mounting holes, conformal coating, under-fill, thermal sensor and temperature screening for -40°C to +85°C. In addition to the new 214 pin DDR3 MicroDIMM product line, Virtium will continue to manufacture 172 pin DDR2 non-ECC unbuffered MicroDIMMs.
Click here for information on DDR3 MicroDIMM

Rugged DIMMs

 

Virtium’s rugged memory modules are being integrated by leading computer manufacturers around the globe, in a wide variety of challenging industries where performance and reliability are paramount. These enhanced DIMMs are temperature screened for the industrial temperature E2 range from -40 to +85 °C and are available with many ruggedized memory enhancements that include conformal coating, under-fill, thermal sensor on board, TDBI and heat spreader. Virtium provides ruggedized memory in a wide range of form factors, memory densities, storage capacities and data transfer rates.
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