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Ruggedized SODIMMs
Virtium, as quick-turn source for extended-temperature DDR2 and DDR3 SODIMMs up to 4GB capacities, can ship them quickly to meet your short lead-time production orders. These ruggedized SODIMMs are designed to satisfy demanding memory applications in extreme environments such as mobile ruggedized computers, embedded systems, military, aerospace, telecom equipment or networking and storage.
Read More …
Read More …
Memory System Tradeoffs
Memory system tradeoffs: embedded DRAM in SoCs, Chip-on-Board, multichip packages or memory modules: For design engineers developing the next generation motherboards, DRAM memory is becoming a major concern as end-users demand more memory. Software operating systems are getting larger and the applications are demanding more RAM than ever before. New technologies, such as server virtualization, multi-core processor chips and dense blade servers have all increased the demand for memory. The more processing power you put on a CPU chip, the more you need to support it with memory. System designers are struggling to fit more and more memory onto smaller motherboards. In making up your mind, it is necessary to consider in the context of your design the answers several questions.
Read more at Embedded.com
Read more at Embedded.com
Memory Industry News
JEDEC Press Release: New MO-297 standard for the “slim” version of the 1.8” SSD correlates directly with SFF Committee specification SFF-8156, and Serial ATA International Organization’s (SATA-IO) Revision 2.6 spec.
PICMG Press Release: New standards for the MicroTCA telecom architecture.
The “Green-Memory” movement is beginning to take hold.
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