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Turning Modules into BGA Packages
Virtium has recently expanded it product offering with a new family of microelectronic Multi-Chip Packages (MCPs) in BGA packages, ruggedized solid-state storage (SSD and CF), High Density Memory Modules and a variety of specialty modules using mixed technologies. Our MCPs can combine processors, DSP’s, Flash, SRAM and DRAM into single monolithic devices for chip-on-board (COB) applications.
Read More …
Read More …
DDR3 Mini-UDIMMs
DDR3 Mini-UDIMMs are available in many speed grades and densities and the modules are in the process of JEDEC standardization. If you have a need for DDR3 Mini-UDIMMs in a new project or have current business demand, click the link below.
Memory Industry News
Rambus targets DDR4 DRAMs in JEDEC. Interface technologies aim at 2011 and beyond.
Intel delays Tukwila processors to Q1 2010 to allow the use of faster memory chips.
Update on the AMD “Istanbul” Opteron chip, vs. Intel’s Xeon 5500 Series “Nehalem” processors
Tell us what you think
If you have questions about the newsletter or would like to submit a suggestion, send us a note.
If you have questions about the newsletter or would like to submit a suggestion, send us a note.
