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2Gbit, 256Mx8 DDR2 Samsung/Virtium BGA Component
50% lower cost & faster lead time than Micron MT47H256M8 or Hynix H5PS2G83EMR
DDPs are ideal for chip on-board applications used for miniaturization and ruggedization of embedded single board computers. Virtium will continue mass producing lower cost DDR2 2Gbit dual die packages (DDP) even as most DRAM semiconductor vendors begin shifting their volume focus to DDR3 technology. The Virtium lower cost 2Gbit DDR2 DDP has a JEDEC standard BGA pattern pin assignment and is an exact drop-in replacement to the Micron MT47H256M8 and Hynix H5PS2G83EMR. If you would like a continuity of supply for DDR2 2Gbit DDPs at lower cost and with short production lead-times, click the link below.
DDR3 ECC registered SO-RDIMMs
High Density DDR3 ECC registered SO-RDIMMs are now available in many speed grades with densities up to 4GB. If you have a need for DDR3 ECC registered SO-RDIMMs, click the link below.
I have a need for DDR3 SO-RDIMMs
I have a need for DDR3 SO-RDIMMs
DDR3 ECC unbuffered SO-UDIMMs
High Speed DDR3 ECC unbuffered SO-UDIMMs are now available to support DDR3 chipsets from Intel, Freescale and others. Click the link below to get more information on low cost high density DDR3 ECC SO-UDIMMs from Virtium.
I have a need for DDR3 SO-UDIMMs
I have a need for DDR3 SO-UDIMMs
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