Press Releases
July 28, 2010
Virtium has announced the release of a new design for the 4GB DDR3 ECC UNBUFFERED Mini-DIMM in the Ultra Low Profile (ULP) 0.700” form factor with a minimal module thickness of 0.140” or 3.56mm. Virtium is the first to release the enhanced DDR3 4GB VLP Mini-DIMM (MiniDIMM) model design using mainstream 2Gbit DDR3 DRAM monolithic package components.
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May 26, 2010
Virtium has stated that it will provide long term DDR1 and DDR2 product support with the continued production of DDR1 and DDR2 even when other memory suppliers have concentrated their production on DDR3 memory modules. Virtium's strategy is to provide long-term support and supply for legacy DRAM for long-life applications.
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May 5, 2010
Virtium has announced that its high performance DDR3 ECC unbuffered SO-UDIMMs optimized for Intel’s next generation, high performance processors are now full production to fulfill large volume orders. “Virtium was the first to release a DDR3 SO-UDIMM in July 2009 and has been working on a JEDEC task group to make them an industry standard with the focus on Intel next generation high performance, scalable, low power platforms.
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April 15, 2010
Virtium Technology announces the availability of ruggedized DDR3 MicroDIMMs.
These very small form factor DDR3 MicroDIMMs are 20-25% smaller than standard SODIMMs and have a mechanical outline of only 54mm wide x 30mm tall.
“Virtium’s new line of ruggedized industrial MicroDIMMs are operational in the industrial temperature range of -40°C to +85°C making them suitable for many rugged applications such as military-aerospace computers, rugged mobile notebooks, small handheld devices and compact embedded systems” said Bob Berry, Virtium’s Vice President of Sales. “Our DDR3 MicroDIMMs are available in 1GB, 2GB and 4GB densities at speeds up to PC3-10600 and come with a variety of optional features to meet most MicroDIMM requirements.”
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March 17, 2010
Virtium Technology received a large (undisclosed) order to provide military rugged memory modules to a major defense contractor to fulfill a significant government contract. Virtium supplied small form factor, ruggedized and reliable military DIMMs and SODIMMs that are capable of performing at extended temperature ranges in the toughest environments where lives depend on the speed and reliability of technology. This contract award strengthens Virtium’s position as a leading supplier of memory to the military and aerospace programs using rugged computers, rugged notebook computers and rugged tablet computers.
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February 17, 2010
Virtium is now offering extended temperature and rugged DDR2 nonECC SODIMM and DDR3 SO-UDIMM with ECC. The enhanced SODIMMs are specifically designed for use in the industrial temperature E2 range from -40 to +85 °C. Industrial temperature and wide temperature SODIMMs are suitable for high reliability requirements such as ruggedized computers, industrial computers, industrial PCs, Single Board Computers (SBCs), embedded computing platforms and telecommunication servers. Virtiums industrial temperature memory is also found inside networking appliances, medical and science research instrumentation. These extended temperature memory solutions are not only designed to operate at extreme temperatures, but are also functional at high shock and vibration in hostile environmental conditions. Today, high temperature memory, and in particular, high temperature SODIMMs are now part of mobile computers, rugged laptops and notebooks used by law enforcement or government agencies for homeland security. Virtium also offers unique military memory solutions by providing rugged memory created for highly advanced military technology or in aerospace applications deployed by defense contractors. Virtium’s rugged memory modules are available with many ruggedized memory enhancements in a wide range of form factors, memory densities, storage capacities and data transfer rates.
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January 26, 2010
Virtium has added the DDR3 MiniDIMM and DDR3 VLP MiniDIMM to the DDR3 high density product family for Telecom, Networking, Storage, embedded computing and industrial applications. These new small footprint memory modules are available now at densities up to 4GB, with future expansion to 8GB, and are well suited for vertically mounted space-constrained designs. They use monolithic DRAM that have an extended / industrial temperature range (-40° to 85°C) which makes them ideal as rugged AdvancedTCA memory (ATCA memory), AdvancedMC memory, MicroTCA memory, PicoTCA memory, AMC memory and COM Express memory for blades, SBB canisters or PICMG SBC applications.
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July 23, 2009
Atom based ETX-AT module supports SATA SSD and DDR2 Memory on a single SODIMM ADLINK's ETX-AT computer-on-module is designed to support Virtium's SSDDR SODIMMs while remaining fully backward compatible with standard DDR2 SODIMMs
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March 30 - April 3, 2009 - Virtium Technology Exhibiting at Embedded System Conference 2009.
Company Introducing the Next Evolution in Solid State Storage Technology: A family of products that include SSD SATA SSDDR Modules, DDR3 SSDDR SODIMMs, DDR3 SSDDR Mini-RDIMMs, DDR3 SSDDR RDIMMs
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October 21 - 23, 2008 - Virtium Technology Exhibiting at AdvancedTCA Summit 2008.
Company Introducing DDR & SATA SSD MODULE, SSDDR SODIMM and LeanStor Solid State Storage Board; Participating in Expert Panel Examining Memory Selection and Storage Alternatives for ATCA
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October 20, 2008 â Virtium Introduces SSDDR SODIMM, a Dual-Function DDR and SATA SSD Module on SODIMM Socket
Combined DDR & NAND Flash SATA Module is Long-term Sustainable Solution for Both Solid State Drive Storage Module (SSD Module) and Main Memory Functions in Single Board Computer (SBC) applications
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October 20, 2008 â Virtium Introduces LeanSTOR, The First AdvancedTCA (ATCA) and MicroTCA SATA SSD Storage Board with FLASH Mounted Directly Onboard
LeanSTOR Solid State Storage Board (SSD Board) Designed Specifically for MicroTCA SSD, AdvancedTCA SSD, AMC SSD applications
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August 19, 2008 - VIRTIUM INTRODUCES DDR3 VERY LOW PROFILE (VLP) UNBUFFERED DIMM MEMORY MODULE
Ideal for Space-Constrained Applications in Embedded Computing; DDR3 0.72-inch VLP Unbuffered Modules Available for Engineering Evaluation
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May 28-29, 2008 - Virtium Technology Exhibiting at MicroTCA Summit 2008 Memory
Technology Experts On-Hand to Discuss Latest Trends and Company Products Offering for the Emerging MicroTelecommunications Computing Architecture Platform
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April 14 - 18, 2008 - Virtium Technology Exhibiting at Embedded Systems Conference Silicon Valley 2008
Experts On-Hand to Discuss DDR3 Technology Used in ECC SO-DIMM, DIMM and MINI-DIMM Products
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February 5-6, 2008 - Virtium Technology Exhibiting at DesignCon 2008
Experts On-Hand to discuss New DDR3 Fly-By Topology Used in ECC SO-DIMM, DIMM and MINI-DIMM Products Press Releases
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