Featured Products
SATA SSD & DDR Memory on Single Module
LeanSTOR AdvancedMC, ATCA, μTCA Storage Flash Components Soldered On Board
DDR3 – Registered ULP (Ultra Low Profile) RDIMM
February 2010
Virtium is now offering extended temperature and rugged DDR2 nonECC SODIMM and DDR3 SO-UDIMM with ECC. The enhanced SODIMMs are specifically designed for use in the industrial temperature E2 range from -40 to +85 °C. Industrial temperature and wide temperature SODIMMs are suitable for high reliability requirements such as ruggedized computers, industrial computers, industrial PCs, Single Board Computers (SBCs), embedded computing platforms and telecommunication servers. Virtiums industrial temperature memory is also found inside networking appliances, medical and science research instrumentation. These extended temperature memory solutions are not only designed to operate at extreme temperatures, but are also functional at high shock and vibration in hostile environmental conditions. Today, high temperature memory, and in particular, high temperature SODIMMs are now part of mobile computers, rugged laptops and notebooks used by law enforcement or government agencies for homeland security. Virtium also offers unique military memory solutions by providing rugged memory created for highly advanced military technology or in aerospace applications deployed by defense contractors. Virtium’s rugged memory modules are available with many ruggedized memory enhancements in a wide range of form factors, memory densities, storage capacities and data transfer rates.
For more details, and Press Release, click here
For more details, and Press Release, click here
January 2010
Virtium has added the DDR3 MiniDIMM and DDR3 VLP MiniDIMM to the DDR3 high density product family for Telecom, Networking, Storage, embedded computing and industrial applications. These new small footprint memory modules are available now at densities up to 4GB, with future expansion to 8GB, and are well suited for vertically mounted space-constrained designs. They use monolithic DRAM that have an extended / industrial temperature range (-40° to 85°C) which makes them ideal as rugged AdvancedTCA memory (ATCA memory), AdvancedMC memory, MicroTCA memory, PicoTCA memory, AMC memory and COM Express memory for blades, SBB canisters or PICMG SBC applications.
For more details, and Press Release, click here
For more details, and Press Release, click here
November 2009
Virtium Technology has recently received official certification for ISO 9001:2000 and AS9100 Rev B for conformance to the requirements of the latest version of AS9104 Rev A. by ISA, which is accredited under the Aerospace Registrar Management Program. Virtium is also registered and is part of the Online Aerospace supplier information system.
For more details, please visit
https://shop.sae.org/servlets/index?PORTAL_CODE=IAQG
For more details, please visit
https://shop.sae.org/servlets/index?PORTAL_CODE=IAQG
October 2009
Virtium has just introduced its new line of DDR3 Very High Density (VHD) DIMMs in the following form factors: 16GB RDIMMs, 8GB VLP RDIMMs, 4GB VLP mini-RDIMMs and 4GB ECC/nonECC VLP UDIMMs. These new high density memory modules provide significant performance improvements for high-end chipsets, quad core processors and new operating systems such as Microsoft Windows 7, Windows Embedded Server and Windows Embedded Enterprise. The Virtium DDR3 VHD DIMMs are well suited for space-confined applications in embedded systems, military/aerospace computers, telecom networking equipment and storage platforms.
September 2009
VIRTIUM provides DDR3 product solutions to industry issues by offering:
1) DDR3 LOW PROFILE 0.720" Unb-DIMM ECC 1GB, 2GB, 4GB
2) DDR3 1.180" Reg-SODIMM ECC (SORDIMM) 1GB, 2GB, 4GB (JEDEC in progress
3) DDR3 1.180" Unb-SODIMM ECC (SO-UDIMM) 1GB, 2GB, 4GB (JEDEC in progress)
4) DDR3 1.180" Unb SODIMM non ECC (SODIMM) (extended temperature screening & heat spreader optional) (up to 4GB)
2) DDR3 1.180" Reg-SODIMM ECC (SORDIMM) 1GB, 2GB, 4GB (JEDEC in progress
3) DDR3 1.180" Unb-SODIMM ECC (SO-UDIMM) 1GB, 2GB, 4GB (JEDEC in progress)
4) DDR3 1.180" Unb SODIMM non ECC (SODIMM) (extended temperature screening & heat spreader optional) (up to 4GB)
August 2009
Virtium Technology’s new SSDDR module (SATA SSD and DDR2 Memory on a single SODIMM) is featured on the Adlink ETX-AT embedded computer.
“ADLINK Technology, Inc. (TAIEX: 6166), a global provider of trusted embedded products, announces its highly popular ETX-AT computer-on-module based on the Intel® Atom™ N270 has been designed and verified for use with Virtium's SSDDR SODIMM dual function memory modules, while maintaining full backwards compatibility with standard SODIMM memory. Virtium's SSDDR combines a NAND Flash Serial ATA Solid State Drive (SATA SSD) and DDR2 memory on a single SODIMM module by utilizing reserved pins on the SODIMM for SATA interface signal transfer, thereby remaining fully JEDEC compatible. This allows the SSDDR modules and standard DDR2 modules to be fully interchangeable within the same SODIMM socket. When the ETX-AT is equipped with the SSDDR SODIMM solution, data throughput dramatically increases two to four times compared to that of standard embedded SSD, USB interface, CompactFlash and SD cards. The SSDDR SODIMM is the higher performance SATA disk-on-module solution for embedded applications.”
For more details, please visit
http://www.adlinktech.com/news/news_detail.php?file=Products/n_2009_14.htm
“ADLINK Technology, Inc. (TAIEX: 6166), a global provider of trusted embedded products, announces its highly popular ETX-AT computer-on-module based on the Intel® Atom™ N270 has been designed and verified for use with Virtium's SSDDR SODIMM dual function memory modules, while maintaining full backwards compatibility with standard SODIMM memory. Virtium's SSDDR combines a NAND Flash Serial ATA Solid State Drive (SATA SSD) and DDR2 memory on a single SODIMM module by utilizing reserved pins on the SODIMM for SATA interface signal transfer, thereby remaining fully JEDEC compatible. This allows the SSDDR modules and standard DDR2 modules to be fully interchangeable within the same SODIMM socket. When the ETX-AT is equipped with the SSDDR SODIMM solution, data throughput dramatically increases two to four times compared to that of standard embedded SSD, USB interface, CompactFlash and SD cards. The SSDDR SODIMM is the higher performance SATA disk-on-module solution for embedded applications.”
For more details, please visit
http://www.adlinktech.com/news/news_detail.php?file=Products/n_2009_14.htm
July 2009
Virtium will continue mass producing lower cost DDR2 2Gbit dual die packages (DDP) as most DRAM semiconductor vendors begin shifting their volume focus to DDR3 technology. Virtium 2Gbit DDR2 DDP have a JEDEC standard BGA pattern pin assignment and are a drop-in replacement for 2Gbit DDPs from Micron, Hynix and other DRAM vendors.
June 2009
Virtium is one of the summit speakers at the 4th Annual Flash Memory Summit at the Santa Clara Convention Center on August 11-13, 2009, in Santa Clara, California. Phan Hoang, VP R&D, will be presenting “Integrating Solid State Storage and DRAM onto Standard Memory Module Form Factors” in Forum F2A on Tuesday, August 11 from 2:40 to 5:30 pm. Click here for info
May 2009
Virtium is one of the MicroTCA Summit sponsors and a summit speaker at this years show on May 12 - 14, in Chantilly, Virginia. The topic of the presentation will be SSDDR and how this combined DRAM memory and Flash storage advancement will be a benefit in the new MicroTCA telecom architecture. Click here for info
Virtium Technology sponsored 3rd Annual SAVICE Charity Golf Tournament on May 5th at the Coto de Gaza golf course. 98 golfers participated; the event netted $93,692 for underprivileged Vietnamese children’s education. This popular day-long tournament symbolizes Virtium’s commitment to improve living conditions and future of children worldwide. It included social hour for friends and colleagues in the industry at the resort as well as raffles and prices, dinner and recognition of the sponsors and golfers.
For more info please visit www.savice.org
April 2009
On May 12 - 14, Virtium will be in Booth #100 at the MicroTCA Summit in Chantilly, Virginia. This show will focus on the new MicroTCA telecom architecture and the Virtium LeanSTOR product will be on exhibit. The LeanSTOR blade storage product is a perfect fit in MicroTCA applications.Click here for info on Virtium at the show
March 2009
This years ESC Silicon Valley Expo in San Jose CA from March 30 to April 2 promises to be a most interesting show as Virtium Technology will be demonstrating its new Solid-State DDR SSDDR memories, LeanSTOR telecom blade storage and DDR3 memory modules. Please visit us at booth # 236 to see first hand how these new technologies can enhance your embedded system designs. Information about the ESC show, can be found at ESC Silicon Valley 2009
February 2009
Virtium Technology will be exhibiting at the Embeddedworld 2009 Exhibition & Conference in Nuremberg, Germany from 03/03/09 - 03/05/09. Please stop by and visit us at booth # 9-218 in Hall 9 to see the latest developments in memory and solid state storage solutions for mission critical embedded computing applications. For more information about the show, visit Embeddedworld 2009 Exhibition & Conference
January 2009
Virtium expands its Engineering team with an addition of a new R&D Center in Vietnam for faster customer response and additional product design capacity. The facility supports Virtium’s global Engineering commitments and is uniquely focused on close and timely support of Asian customers and projects. It employs EE and IT engineers who work on PCB layout, FPGA and micro-controller design as well as hardware design for SSDDR and LeanStor products.