Featured Products
August 2008
At the Intel Developer Forum (IDF), Virtium will announce the addition of the DDR3 0.72-inch Very Low Profile (VLP) unbuffered DIMM module to its family of DDR3 memory products for embedded systems. The new DDR3 0.72” VLP unbuffered memory product is ideal for space-constrained applications for next-generation products in embedded computing, AdvancedTCA (ATCA) and MicroTCA (MTCA), as well as many other applications that require the blade server form factor. Module densities of up to 2GB are now available for engineering evaluation with production by year end.
Virtium’s DDR3 0.72-inch VLP unbuffered DIMM was developed to meet the specific needs of our customers. DDR3 Fly-By architecture posed many technical challenges for small form factor memory, especially in the unbuffered mode. Virtium overcame these challenges with engineering expertise in layout, simulation and mechanical design. This innovative DDR3 0.72-inch VLP unbuffered solution is only available through Virtium. Customers who need to scale down the real estate of their systems will gain significant competitive advantage with Virtium’s new DDR3 unbuffered solution.
In supporting Intel’s invitation only event, Virtium will have product experts on duty at booth #633 to provide technical consultation on the applications of the DDR3 0.72 inch VLP unbuffered DIMM.
July 2008
Virtium discuss choices in solid state storage products and innovative solutions in the horizon in CompactPCI and Advanced TCA systems. See Choices in Advanced TCA storage technology at http://www.compactpci-systems.com/articles/id/?3391.June 2008
Through the validation process with JEDEC, Virtium’s innovation and leadership once again enables an open industry standard reference design for other engineers. JEDEC balloted and passed the JEDEC Task Group proposal for the connector pin out and specification body for the DDR3 72b-ECC-SODIMM family of designs. Virtium currently leads the Task Group as the first generation of 1GB/2GB 72b-ECC-SODIMM and 72b-ECC-SORDIMM modules have moved from simulation into the pcb routing phases of these projects. Prototype modules are expected to be available in the late July timeframe to meet the high demand from the Research and Development groups throughout the industry.May 2008
Virtium assists design engineers with published article in Embedded Computing Design. See Thermal concepts enhance DRAM memory subsystem designs at http://www.embedded-computing.com/articles/id/?3267.April 2008
Virtium Technology is organizing the 2nd Annual SAVICE Golf Classic at Dove Canyon Country Club in Dove Canyon, California. SAVICE is a non-profit charity organization which raises funds to assist educational needs of underprivileged children in rural Vietnam. Last year, SAVICE's sponsors contributed $80,057 for scholarships to 477 students and for building two classrooms.March 2008
Virtium will be participating in the Embedded Systems Conference 2008 in San Jose Conference Center on April 15 - 17, 2008. 350 exhibitors will be showing software and hardware the Embedded industry.. Exhibitors include ARM, Texas Instruments, Freescale, Microchip, Green Hills, Microsoft, National Instruments and Xilinx.February 2008
Virtium Technology leads the Jedec task group for standardizing the DDR3 ECC-SODIMM modules. The task group plans to ballot the pinout at the June Jedec meeting. The up to date pinout was sent to task group members and is expected to be complete for general use by May-June. First generation reference designs are targeted for prototypes by June-July 2008. The specification and reference designs are expected to be balloted at the September Jedec meeting.January 2008
Virtium Technology exhibited at DesignCon 2008 www.designcon.com conference in the Santa Clara Convention Center on February 4 -7. The conference was hosted by the International Engineering Consortium www.iec.org. Its motto "Connecting the World of Electronic Design" also reflects the commitment of Virtium Technology and its continuing endeavor to assist the Hardware Design Engineer with memory related design issues. Our Engineers gained a valuable insight into new design issues. Virtium Technology exhibit staff enjoyed the constructive exchange with attending Engineers regarding their design issues and project questions.