Featured Products
SATA SSD & DDR Memory on Single Module
LeanSTOR AdvancedMC, ATCA, μTCA Storage Flash Components Soldered On Board
DDR3 – Registered ULP (Ultra Low Profile) RDIMM
July 2009
Virtium will continue mass producing lower cost DDR2 2Gbit dual die packages (DDP) as most DRAM semiconductor vendors begin shifting their volume focus to DDR3 technology. Virtium 2Gbit DDR2 DDP have a JEDEC standard BGA pattern pin assignment and are a drop-in replacement for 2Gbit DDPs from Micron, Hynix and other DRAM vendors.
June 2009
Virtium is one of the summit speakers at the 4th Annual Flash Memory Summit at the Santa Clara Convention Center on August 11-13, 2009, in Santa Clara, California. Phan Hoang, VP R&D, will be presenting “Integrating Solid State Storage and DRAM onto Standard Memory Module Form Factors” in Forum F2A on Tuesday, August 11 from 2:40 to 5:30 pm. Click here for info
May 2009
Virtium is one of the MicroTCA Summit sponsors and a summit speaker at this years show on May 12 - 14, in Chantilly, Virginia. The topic of the presentation will be SSDDR and how this combined DRAM memory and Flash storage advancement will be a benefit in the new MicroTCA telecom architecture. Click here for info
Virtium Technology sponsored 3rd Annual SAVICE Charity Golf Tournament on May 5th at the Coto de Gaza golf course. 98 golfers participated; the event netted $93,692 for underprivileged Vietnamese children’s education. This popular day-long tournament symbolizes Virtium’s commitment to improve living conditions and future of children worldwide. It included social hour for friends and colleagues in the industry at the resort as well as raffles and prices, dinner and recognition of the sponsors and golfers.
For more info please visit www.savice.org
April 2009
On May 12 - 14, Virtium will be in Booth #100 at the MicroTCA Summit in Chantilly, Virginia. This show will focus on the new MicroTCA telecom architecture and the Virtium LeanSTOR product will be on exhibit. The LeanSTOR blade storage product is a perfect fit in MicroTCA applications.Click here for info on Virtium at the show
March 2009
This years ESC Silicon Valley Expo in San Jose CA from March 30 to April 2 promises to be a most interesting show as Virtium Technology will be demonstrating its new Solid-State DDR SSDDR memories, LeanSTOR telecom blade storage and DDR3 memory modules. Please visit us at booth # 236 to see first hand how these new technologies can enhance your embedded system designs. Information about the ESC show, can be found at ESC Silicon Valley 2009
February 2009
Virtium Technology will be exhibiting at the Embeddedworld 2009 Exhibition & Conference in Nuremberg, Germany from 03/03/09 - 03/05/09. Please stop by and visit us at booth # 9-218 in Hall 9 to see the latest developments in memory and solid state storage solutions for mission critical embedded computing applications. For more information about the show, visit Embeddedworld 2009 Exhibition & Conference
January 2009
Virtium expands its Engineering team with an addition of a new R&D Center in Vietnam for faster customer response and additional product design capacity. The facility supports Virtium’s global Engineering commitments and is uniquely focused on close and timely support of Asian customers and projects. It employs EE and IT engineers who work on PCB layout, FPGA and micro-controller design as well as hardware design for SSDDR and LeanStor products.
December 2008
Virtium implemented SAP Business One software which is being used by Fortune 500 corporations to streamline and control operations to further speed up customer response and to accelerate profitable growth. The software provides a single solution for managing an entire business – from sales and customer relationships to financials and operations. Our customers will be able to log on to the system to determine current order status. These improvements further reinforce our commitment to exceptional service and “Going the Extra Mile for the customer” philosophy.
November 2008
Manufacturing department finished a major upgrade of equipment to increase turnaround speed, production capacity, add manufacturing flexibility. Additionally the upgrade increased Virtium’s ability to utilize the newest component technologies in our products. Virtium Technology customers can now get the full benefits of newest technology, greater manufacturing flexibility and quicker turnaround. The new equipment increases productivity and reduces costs. Resulting savings are passed on to customers, increasing Virtiums’ product values.
October 2008
Virtium Technology is exhibiting at the AdvancedTCA Summit in Santa Clara Conference Center on October 21 - 23. Visit us at booth # 215 We will present "Choices in ATCA storage" in "Intro ATCA 101" program session on Wednesday, October 22nd at 8:30AM. Paul M. Dinh,Director of Technical Marketing will compare Hard Disk Drive (HDD), Solid State Drive (SSD) and Flash-on-board options to help the AdvancedTCA community better understand the technology that best fits various applications. Virtium also plans to unveil two major new Storage product lines at the Summit, giving the Hardware engineer unique choices in faster, more flexible and light weight storage options
September 2008
Virtium is the only manufacturer that offers the 0.72-inch low profile that enables system designers to fit 4GB DDR2 0.72-inch VLP Registered Mini-RDIMM 667 of main memory in highly space constrained applications. The Mini-RDIMM industry form factor provides additional design flexibility because it can be mounted in the vertical, right-angled, or angled sockets.
Virtium is shipping 4GB DDR2 0.72-inch VLP Registered Mini-RDIMM 667 to customers with applications in the Advanced TCA market in response to the needs for high memory density, high speed and Very Low Profile (VLP) in Mini-RDIMM form factor.
Virtium 4GB DDR2 0.72-inch VLP Registered Mini-RDIMM 667 addresses the urgent needs for higher memory density in AMC data carrier blade applications for switch management as well as many other embedded applications where higher memory density and very low profile DDR2 SDRAM modules are required.
Virtium’s solution is enabling legacy boards with single socket for main memory to double or in some cases quadruple its size in memory density and meeting the ever changing and challenging demands for memory products. In addition, the 4GB DDR2 0.72-inch VLP Registered Mini-RDIMM is now being designed in the next generation boards with multi-sockets for main memory and in boards with more densely populated components.
Virtium is shipping 4GB DDR2 0.72-inch VLP Registered Mini-RDIMM 667 to customers with applications in the Advanced TCA market in response to the needs for high memory density, high speed and Very Low Profile (VLP) in Mini-RDIMM form factor.
Virtium 4GB DDR2 0.72-inch VLP Registered Mini-RDIMM 667 addresses the urgent needs for higher memory density in AMC data carrier blade applications for switch management as well as many other embedded applications where higher memory density and very low profile DDR2 SDRAM modules are required.
Virtium’s solution is enabling legacy boards with single socket for main memory to double or in some cases quadruple its size in memory density and meeting the ever changing and challenging demands for memory products. In addition, the 4GB DDR2 0.72-inch VLP Registered Mini-RDIMM is now being designed in the next generation boards with multi-sockets for main memory and in boards with more densely populated components.
August 2008
At the Intel Developer Forum (IDF), Virtium will announce the addition of the DDR3 0.72-inch Very Low Profile (VLP) unbuffered DIMM module to its family of DDR3 memory products for embedded systems. The new DDR3 0.72” VLP unbuffered memory product is ideal for space-constrained applications for next-generation products in embedded computing, AdvancedTCA (ATCA) and MicroTCA (MTCA), as well as many other applications that require the blade server form factor. Module densities of up to 2GB are now available for engineering evaluation with production by year end.
Virtium’s DDR3 0.72-inch VLP unbuffered DIMM was developed to meet the specific needs of our customers. DDR3 Fly-By architecture posed many technical challenges for small form factor memory, especially in the unbuffered mode. Virtium overcame these challenges with engineering expertise in layout, simulation and mechanical design. This innovative DDR3 0.72-inch VLP unbuffered solution is only available through Virtium. Customers who need to scale down the real estate of their systems will gain significant competitive advantage with Virtium’s new DDR3 unbuffered solution.
Virtium’s DDR3 0.72-inch VLP unbuffered DIMM was developed to meet the specific needs of our customers. DDR3 Fly-By architecture posed many technical challenges for small form factor memory, especially in the unbuffered mode. Virtium overcame these challenges with engineering expertise in layout, simulation and mechanical design. This innovative DDR3 0.72-inch VLP unbuffered solution is only available through Virtium. Customers who need to scale down the real estate of their systems will gain significant competitive advantage with Virtium’s new DDR3 unbuffered solution.
In supporting Intel’s invitation only event, Virtium will have product experts on duty at booth #633 to provide technical consultation on the applications of the DDR3 0.72 inch VLP unbuffered DIMM.
July 2008
Virtium discuss choices in solid state storage products and innovative solutions in the horizon in CompactPCI and Advanced TCA systems. See Choices in Advanced TCA storage technology at http://www.compactpci-systems.com/articles/id/?3391.
June 2008
Through the validation process with JEDEC, Virtium’s innovation and leadership once again enables an open industry standard reference design for other engineers. JEDEC balloted and passed the JEDEC Task Group proposal for the connector pin out and specification body for the DDR3 72b-ECC-SODIMM family of designs. Virtium currently leads the Task Group as the first generation of 1GB/2GB 72b-ECC-SODIMM and 72b-ECC-SORDIMM modules have moved from simulation into the pcb routing phases of these projects. Prototype modules are expected to be available in the late July timeframe to meet the high demand from the Research and Development groups throughout the industry.
May 2008
Virtium assists design engineers with published article in Embedded Computing Design. See Thermal concepts enhance DRAM memory subsystem designs at http://www.embedded-computing.com/articles/id/?3267.
April 2008
Virtium Technology is organizing the 2nd Annual SAVICE Golf Classic at Dove Canyon Country Club in Dove Canyon, California. SAVICE is a non-profit charity organization which raises funds to assist educational needs of underprivileged children in rural Vietnam. Last year, SAVICE's sponsors contributed $80,057 for scholarships to 477 students and for building two classrooms.
March 2008
Virtium will be participating in the Embedded Systems Conference 2008 in San Jose Conference Center on April 15 - 17, 2008. 350 exhibitors will be showing software and hardware the Embedded industry.. Exhibitors include ARM, Texas Instruments, Freescale, Microchip, Green Hills, Microsoft, National Instruments and Xilinx.
February 2008
Virtium Technology leads the Jedec task group for standardizing the DDR3 ECC-SODIMM modules. The task group plans to ballot the pinout at the June Jedec meeting. The up to date pinout was sent to task group members and is expected to be complete for general use by May-June. First generation reference designs are targeted for prototypes by June-July 2008. The specification and reference designs are expected to be balloted at the September Jedec meeting.
January 2008
Virtium Technology exhibited at DesignCon 2008 www.designcon.com conference in the Santa Clara Convention Center on February 4 -7. The conference was hosted by the International Engineering Consortium www.iec.org. Its motto "Connecting the World of Electronic Design" also reflects the commitment of Virtium Technology and its continuing endeavor to assist the Hardware Design Engineer with memory related design issues. Our Engineers gained a valuable insight into new design issues. Virtium Technology exhibit staff enjoyed the constructive exchange with attending Engineers regarding their design issues and project questions.