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December 2008

Virtium implemented SAP Business One software which is being used by Fortune 500 corporations to streamline and control operations to further speed up customer response and to accelerate profitable growth. The software provides a single solution for managing an entire business – from sales and customer relationships to financials and operations. Our customers will be able to log on to the system to determine current order status. These improvements further reinforce our commitment to exceptional service and “Going the Extra Mile for the customer” philosophy.

November 2008

Manufacturing department finished a major upgrade of equipment to increase turnaround speed, production capacity, add manufacturing flexibility. Additionally the upgrade increased Virtium’s ability to utilize the newest component technologies in our products. Virtium Technology customers can now get the full benefits of newest technology, greater manufacturing flexibility and quicker turnaround. The new equipment increases productivity and reduces costs. Resulting savings are passed on to customers, increasing Virtiums’ product values.

October 2008

Virtium Technology is exhibiting at the AdvancedTCA Summit in Santa Clara Conference Center on October 21 - 23. Visit us at booth # 215 We will present "Choices in ATCA storage" in "Intro ATCA 101" program session on Wednesday, October 22nd at 8:30AM. Paul M. Dinh,Director of Technical Marketing will compare Hard Disk Drive (HDD), Solid State Drive (SSD) and Flash-on-board options to help the AdvancedTCA community better understand the technology that best fits various applications. Virtium also plans to unveil two major new Storage product lines at the Summit, giving the Hardware engineer unique choices in faster, more flexible and light weight storage options

September 2008

Virtium is the only manufacturer that offers the 0.72-inch low profile that enables system designers to fit 4GB DDR2 0.72-inch VLP Registered Mini-RDIMM 667 of main memory in highly space constrained applications. The Mini-RDIMM industry form factor provides additional design flexibility because it can be mounted in the vertical, right-angled, or angled sockets.

Virtium is shipping 4GB DDR2 0.72-inch VLP Registered Mini-RDIMM 667 to customers with applications in the Advanced TCA market in response to the needs for high memory density, high speed and Very Low Profile (VLP) in Mini-RDIMM form factor.

Virtium 4GB DDR2 0.72-inch VLP Registered Mini-RDIMM 667 addresses the urgent needs for higher memory density in AMC data carrier blade applications for switch management as well as many other embedded applications where higher memory density and very low profile DDR2 SDRAM modules are required.

Virtium’s solution is enabling legacy boards with single socket for main memory to double or in some cases quadruple its size in memory density and meeting the ever changing and challenging demands for memory products. In addition, the 4GB DDR2 0.72-inch VLP Registered Mini-RDIMM is now being designed in the next generation boards with multi-sockets for main memory and in boards with more densely populated components.

August 2008

At the Intel Developer Forum (IDF), Virtium will announce the addition of the DDR3 0.72-inch Very Low Profile (VLP) unbuffered DIMM module to its family of DDR3 memory products for embedded systems. The new DDR3 0.72” VLP unbuffered memory product is ideal for space-constrained applications for next-generation products in embedded computing, AdvancedTCA (ATCA) and MicroTCA (MTCA), as well as many other applications that require the blade server form factor. Module densities of up to 2GB are now available for engineering evaluation with production by year end.

Virtium’s DDR3 0.72-inch VLP unbuffered DIMM was developed to meet the specific needs of our customers. DDR3 Fly-By architecture posed many technical challenges for small form factor memory, especially in the unbuffered mode. Virtium overcame these challenges with engineering expertise in layout, simulation and mechanical design. This innovative DDR3 0.72-inch VLP unbuffered solution is only available through Virtium. Customers who need to scale down the real estate of their systems will gain significant competitive advantage with Virtium’s new DDR3 unbuffered solution.

In supporting Intel’s invitation only event, Virtium will have product experts on duty at booth #633 to provide technical consultation on the applications of the DDR3 0.72 inch VLP unbuffered DIMM.

July 2008

Virtium discuss choices in solid state storage products and innovative solutions in the horizon in CompactPCI and Advanced TCA systems. See Choices in Advanced TCA storage technology at http://www.compactpci-systems.com/articles/id/?3391.

June 2008

Through the validation process with JEDEC, Virtium’s innovation and leadership once again enables an open industry standard reference design for other engineers. JEDEC balloted and passed the JEDEC Task Group proposal for the connector pin out and specification body for the DDR3 72b-ECC-SODIMM family of designs. Virtium currently leads the Task Group as the first generation of 1GB/2GB 72b-ECC-SODIMM and 72b-ECC-SORDIMM modules have moved from simulation into the pcb routing phases of these projects. Prototype modules are expected to be available in the late July timeframe to meet the high demand from the Research and Development groups throughout the industry.

May 2008

Virtium assists design engineers with published article in Embedded Computing Design. See Thermal concepts enhance DRAM memory subsystem designs at http://www.embedded-computing.com/articles/id/?3267.

April 2008

Virtium Technology is organizing the 2nd Annual SAVICE Golf Classic at Dove Canyon Country Club in Dove Canyon, California. SAVICE is a non-profit charity organization which raises funds to assist educational needs of underprivileged children in rural Vietnam. Last year, SAVICE's sponsors contributed $80,057 for scholarships to 477 students and for building two classrooms.

March 2008

Virtium will be participating in the Embedded Systems Conference 2008 in San Jose Conference Center on April 15 - 17, 2008. 350 exhibitors will be showing software and hardware the Embedded industry.. Exhibitors include ARM, Texas Instruments, Freescale, Microchip, Green Hills, Microsoft, National Instruments and Xilinx.

February 2008

Virtium Technology leads the Jedec task group for standardizing the DDR3 ECC-SODIMM modules. The task group plans to ballot the pinout at the June Jedec meeting. The up to date pinout was sent to task group members and is expected to be complete for general use by May-June. First generation reference designs are targeted for prototypes by June-July 2008. The specification and reference designs are expected to be balloted at the September Jedec meeting.

January 2008

Virtium Technology exhibited at DesignCon 2008 www.designcon.com conference in the Santa Clara Convention Center on February 4 -7. The conference was hosted by the International Engineering Consortium www.iec.org. Its motto "Connecting the World of Electronic Design" also reflects the commitment of Virtium Technology and its continuing endeavor to assist the Hardware Design Engineer with memory related design issues. Our Engineers gained a valuable insight into new design issues. Virtium Technology exhibit staff enjoyed the constructive exchange with attending Engineers regarding their design issues and project questions.

December 2007

Virtium engineering management completed DDR3 New Technologies Tour - an educational, new technology enabling event for OEM customers to enhance the level of understanding and utilization of leading edge memory technologies. This enabling event targeted hardware design Engineers for discussion of DDR3 Reference Designs and related Flyby Architecture. The sessions received constructive feedback and positive reviews.
The resulting new project activity promises another strong growth year for Virtium in 2008.

November 2007

Virtium Receives Preferred Supplier Award from Major OEM

Recognized as a key strategic partner and exceptionally reliable vendor, Virtium has been presented with the Preferred Supplier Award by a major OEM. In a published statement regarding Virtium the well-known OEM commented, "Your team’s dedication to service, quality, and product knowledge is relied upon heavily by our organization and you have always responded quickly when called upon."

October 2007

Virtium Introduces DDR3 Blade Memory Modules for Embedded Computing

In the news

Virtium featured in industry publication ECN

September 2007

Virtium introduces DDR3 ECC SO-DIMMs

August 2007

Virtium celebrates 10 years of history

Virtium Technology Inc., manufacturer of memory modules for specialized computers in demanding environments, today announced it is celebrating its tenth year of business. Virtium is a privately-held, financially-sound technology company with its own U.S.-based design and manufacturing facility. Established in 1997, Virtium has invented and patented an industry breakthrough component, become ISO-9001 certified, and been named to Inc. Magazine's List of 500 Fastest-Growing Private U.S. Companies. Virtium has expanded its facilities five times in less than a decade and continues to challenge its competitors, earning numerous technical excellence awards and the business and respect of some of the world's leading OEMs.

July 2007

Virtium Introduces DDR2 SODIMM Memory Modules with Thermal Heat-Spreader

June 2007

Virtium Hosts SAVICE First Annual Charity Golf Classic

Virtium Expands U.S. Manufacturing Facility

In response to record business growth, Virtium has created additional SMT manufacturing capacity at the company’s Southern California headquarters. The recent factory expansion was completed with new SMT lines that are environmentally-friendly and is certified to produce "green" RoHS compliant products built with the latest BGA technology and small passive components.

In the News
Virtium featured in industry publication EDN

May 2007

Virtium Launches www.RAMpedia.com Memory Reference Tools

In the News
RAMpedia featured in industry publication Electronic Design

April 2007

Virtium Launches DDR2 Blade Memory Modules For Blade Servers

Virtium Receives Quality Award from Leading Embedded Computing OEM

Virtium Launches DDR2 Blade Memory Modules For Embedded Computing

March 2007

Virtium Receives Record Volume Order from a Billion-Dollar OEM

Virtium has been awarded a large (undisclosed) order from a billion-dollar leading supplier of defense electronics systems. This Virtium record-breaking quantity is slated to fulfill a significant government contract.