Welcome again to the Virtium Technology e-letter. Our goal is to bring you vital ideas and information that you can use. We welcome your ideas, too. Please send any feedback or suggestions to us at info@virtium.com   In This Issue: June 2009 1. Turn Modules into BGA MCPs 2. DDR3 Mini-UDIMMs 3. Memory Industry News Spotlight Turning Modules into BGA Packages (MCP) Turning Modules into BGA Packages   Virtium has recently expanded it product offering with a new family of microelectronic Multi-Chip Packages (MCPs) in BGA packages, ruggedized solid-state storage (SSD and CF), High Density Memory Modules and a variety of specialty modules using mixed technologies. Our MCPs can combine processors, DSP’s, Flash, SRAM and DRAM into single monolithic devices for chip-on-board (COB) applications. Read More … BGA Design Request DDR3 Mini-UDIMMs DDR3 Mini-UDIMMs are available in many speed grades and densities and the modules are in the process of JEDEC standardization. If you have a need for DDR3 Mini-UDIMMs in a new project or have current business demand, click the link below. I have a need for DDR3 Mini-UDIMMs Memory Industry News   Rambus targets DDR4 DRAMs in JEDEC. Interface technologies aim at 2011 and beyond. Read More...   Intel delays Tukwila processors to Q1 2010 to allow the use of faster memory chips. Read More...   Update on the AMD “Istanbul” Opteron chip, vs. Intel’s Xeon 5500 Series “Nehalem" processors Read More...   Tell us what you think If you have questions about the newsletter or would like to submit a suggestion, send us a note. To unsubscribe, please send a reply e-mail with UNSUBSCRIBE in the subject line of your e-mail or send email to info@virtium.com. Thank you. Virtium Technology, 30052 Tomas, Rancho Santa Margarita, CA 92688 Phone: 949.888.2444 www.virtium.com