April 9, 2014
Virtium today announced its embedded infrastructure market support for DDR4, and the company’s initial DDR4 RDIMM products. As one of the first to offer DDR4 memory modules, Virtium’s embedded industrial OEM customers are able to have early test and development access to the lower power, high bandwidth and density benefits of this latest DRAM technology. With significant power savings of up to 40% and up to twice the bandwidth over DDR3, the new DDR4 modules are excellent solutions for server blades, networking and telecom applications. Continuing Virtium’s exclusive support for the embedded infrastructure market, these first DDR4 modules are offered in the lower profile ULP RDIMM height in capacities ranging from 4 to 16 GB, and feature low 1.2V configurations with data transfer speeds of 1866 MT/s.
March 27, 2014
Virtium has expanded its executive management team with three new strategic positions. The company announced today that Scott Phillips, Anthony Swiney and Wesley Walston have joined the company as director of marketing, director of program management and inside sales and director of engineering respectively. All memory and storage industry veterans, Phillips, Swiney and Walston bring extensive technology and industry experience in OEM and industrial markets to help Virtium expand and support its rapidly growing global customer base.
February 26, 2014
Virtium today introduced two new 16 and 32 GB DDR3 RDIMM in the Ultra-Low Profile (ULP) 0.70-inch and Very-Low Profile (VLP) 0.738-inch form factors respectively. Virtium’s new memory modules enable customers to add more memory with high density modules at DDR3 speeds achieved at a lower competitive price point. Using Virtium’s advanced design process; these modules deliver lower power consumption through improved airflow for today’s feature-rich industrial server blades, telecom and networking applications that require low profile memory.
February 20, 2014
Significantly expanding the company’s strategic sales channel, Virtium has signed distribution agreements with two of Europe’s top distributors, Altec and More Electronics. Altec has distribution sales responsibility in Central Europe with More Electronics servicing customers in the Scandinavian and Baltic countries. The agreements establish these companies as authorized distributors of Virtium’s complete line of industry-leading StorFly® and TuffDrive® SSDs and industrial memory modules. At Embedded World 2014, Virtium’s full line of products will be showcased February 25-27 in Hall 2, Altec Booth 2-4482.
January 22, 2014
Virtium today expanded its TuffDrive® eUSB embedded SSD product portfolio to include the industry’s highest capacity SLC-based 10-pin eUSB module at 32 GB, and high-performance, fully locked bill-of-material (BOM) eUSB keys. Designed for the faster performance, higher capacity and increased product longevity required by today’s intelligent embedded systems, Virtium TuffDrive eUSB products are optimal storage solutions for primary and boot storage in networking, server, embedded, industrial and transportation applications.
November 21, 2013
Virtium has introduced the industry’s first 16GB DDR3 Mini-RDIMM in the Very-Low Profile (VLP) 0.72-inch form factor. Offering twice as much capacity per slot compared to competitive solutions, Virtium’s new 16GB DDR3 VLP Mini-RDIMM module helps solve the ongoing demand for more memory in today’s complex, feature-rich industrial embedded systems.
October 30, 2013
Virtium has named Michael Nilsson senior vice president of sales. Nilsson has more than 20 years of successful technology industry management experience, and most recently led the sales team at sTec through a period of sustained growth. Michael is responsible for all sales and business development functions at Virtium.
July 11, 2013
Virtium’s next-generation TuffDrive® CF CompactFlash cards offer the industry’s highest SLC NAND flash-based capacity at 64 GB. Designed to deliver the latest storage technology advancements for applications that have not yet migrated to a serial interface, TuffDrive CF cards meet new software and functional system requirements for higher performance and capacity. Virtium is committed to the industrial embedded market and plans to support CompactFlash well into the next decade.
April 17, 2013
Virtium CEO, Phu Hoang, was selected as a winner of the Orange County Business Journal’s Excellence in Entrepreneurship Awards. The awards honor Orange County’s top business leaders for their entrepreneurial spirit and success. Hoang was one of six entrepreneurs that were singled out of 128 nominees to receive awards for exceptional business accomplishments and community contributions.
January 30, 2013
Virtium’s latest 512GB StorFly® 200 Slim SATA (MO-297) SSDs offer the industry’s highest Slim SATA capacity and support industrial operating temperatures of -40° to 85°C. At less than 15% the volume of a 2.5-inch, 9.5mm SSD, Virtium StorFly 200 SSDs give OEMs an optimal small form factor alternative for networking, industrial, AdvancedTCA and other blade applications.
January 23, 2013
Virtium ECC SODIMM memory modules have been proven for use on high-volume MicroServers. Intel® has validated Virtium’s ECC SODIMM modules on its Bordenville MicroServer platform, which paves the way for more mainstream applications to realize the advantages of ECC on a smaller form factor memory module. Virtium’s embedded and industrial systems customers also benefit from better economies of scale due to broader adoption of this technology.
November 8, 2012
Virtium today announced the company has shipped more than 10 million DRAM memory modules. This major milestone underscores Virtium’s success in meeting embedded system OEMs’ needs for memory module innovation and long-term reliability and supply. The total of memory modules shipped includes Virtium’s extensive product portfolio of DDR3/3L, DDR2, DDR and SDRAM in ECC and non-ECC configurations. In addition to standard height RDIMM, UDIMM, SO-RDIMM, SO-UDIMM and MiniDIMM form factors, Virtium memory modules are also available in VLP (18.75mm) and Blade VLP (17.78mm) heights.
October 25, 2012
Virtium has expanded its StorFly SATA SSD portfolio to satisfy embedded system needs for enhanced endurance and industrial temperature SSD storage. Virtium has added the StorFly CE, RE and XE product classes to its existing line of StorFly PE embedded SATA SSDs. The new StorFly product classes are optimized for the data types and workloads of applications ranging from digital signage to industrial automation and networking equipment that have strenuous requirements for ten-year product deployments in harsh environments with 24/7 operation.
September 12, 2012
Virtium today introduced its new line of StorFly® SSDs that are specifically designed for embedded systems that have unique capacity and workload requirements. The StorFly line includes 1.8 and 2.5-inch SATA, Slim SATA, mSATA and CFast form factors that are optimized to meet the storage needs of a diverse range of embedded application usage models, which differ substantially from storage requirements of client or enterprise applications.
July 25, 2012
Virtium today announced that it has expanded its line of low power, low thermal dissipation DDR3L memory modules with a new reduced height VLP form factor. Virtium’s new DDR3L Blade VLP offers an industry- lower-profile (17.78mm) alternative to the JEDEC standard 18.75 mm VLP to provide a cost-effective solution that solves the space-constrained limitations found in many telecom and networking applications.
June 13, 2012
Virtium announces a full line of low power DDR3L memory modules that not only reduce total power for systems that use multiple memory modules, but also reduce thermal dissipation up to 10°C on the DRAM surface. This is a significant benefit for systems that run above 85°C facilitating a considerable increase in system performance by removing the double refresh rate requirement. Virtium 4GB and 8GB DDR3L products are available in RDIMM, UDIMM, SODIMM and Mini DIMM form factors.
February 8, 2012
Virtium has named Gary Drossel its Vice President of Product Strategy. Drossel is responsible for developing Virtium’s product strategies and executing them through the management of the company’s memory and solid-state drive (SSD) product portfolio. In this strategic role, Drossel will also align the product roadmap to the market-driven needs of Virtium’s customers.
December 9, 2011
Virtium announces its high speed PC3-12800 (DDR3-1600) 8GB VLP RDIMM monolithic memory module. This offering is targeted toward high performance bandwidth ATCA blade applications and fulfills the current demand for high speed memory in DDR3-1600 compatible systems.
October 28, 2011
Virtium introduces low power 8GB VLP DDR3 registered MiniDIMM industrial memory modules. They are designed for low power consumption embedded and telecommunications applications. 8GB VLP DDR3 Registered MiniDIMM expands Virtium’s VLP DIMM (Very Low Profile DIMM) industrial memory product line. Virtium’s low power 8GB VLP DDR3 registered MiniDIMM provides higher performance with significantly lower power while meeting space and extended product life cycle requirements.
Virtium continues to provide innovative and reliable solutions in Ruggedized Applications for Industrial Embedded and Telecommunications OEMs. Engineers and product specialists at Virtium are proud to announce a newly developed and highly effective locking device technology for use with various industrial SO-DIMM, ECC SODIMM, DIMM and Mini DIMM modules in rugged application designs. This leading-edge technology has evolved through Virtium’s continuous approach to providing solutions that help to overcome harsh environment and vibration challenges faced by Industrial memory OEMs.
Virtium Technology, Inc.,a solutions driven-designer and manufacturer of Industrial Memory and Flash Storage Solutions for Embedded and Communication OEMs, announced its newly developed and highly efficient Industrial CF (Compact Flash) Solution supporting large page flash for NAND technology. This will serve to extend the CompactFlash form factor life cycle by seven more years in Industrial Embedded and Communication applications.
August 8, 2011
Virtium Technology Inc., a solutions driven-designer and manufacturer of industrial memory and flash storage solutions for embedded and communication OEMs is sponsoring the Annual Flash Memory Summit, taking place from August 8th-11th 2011 in Santa Clara, CA.
June 16, 2011
Virtium Technology, Inc. a leading designer and manufacturer of long-life memory modules for mission-critical applications, today announced its new low power DDR3 Unbuffered DIMM in the Very-Low Profile (VLP). Virtium’s new DDR3 Unbuffered DIMM modules deliver on three key requirements; low power, high density and small size.
Virtium introduced a comprehensive new line of standard and industrial temperature Flash solutions, designated TuffDisk. An expansion of Virtium’s DRAM offering, the new TuffDisk line is optimized for the high reliability and endurance needs of a wide variety of embedded OEM military-aerospace, networking-telecommunications, medical, storage server and gaming applications. Tuffdisk integrates SLC NAND Flash coupled with advanced wear leveling algorithms that ensure its endurance meets a minimum of 2M write/erase cycles. Virtium’s new Flash solutions also meet a broad range of embedded OEM application goals including long product life, cost, high speed, compatibility and low power. The line of Tuffdisk products support PATA, SATA, USB, and SD with form factors embracing industrial OEM proven packaging standards of SSDs, SD Cards, eUSB, SD, CF, CFast, mSATA, SlimSATA, amongst others.
What sets the new TuffDisk products apart, is Virtium’s enhanced product support and extended product life management. Virtum offers its extended support to overcome OEM concerns regarding ongoing NAND Flash die shrinkage and regular controller firmware changes that can cause significant system incompatibility issues for Flash storage users. That is why Virtium, as part of its service offering, will work closely with customers to define a test environment that will guarantee compatibility. Virtium will then use a customer’s approved test method throughout its production process on either the customer’s actual hardware or hardware that has been approved.
Virtium has launched a new website to better serve the informational and product support needs of its customers. The new website features an enhanced graphical look and updated navigation enabling users to quickly find a specific Virtium memory or Flash solution datasheet. Virtium’s new website also provides increased content about the company’s extensive capabilities that include supply chain management, manufacturing, testing and quality assurance.
Virtium’s OEM customers in the embedded computing, telecommunications, networking, storage, military, infotainment and medical markets now can learn additional details about Virtium’s collaborative customer approach. This approach is what sets Virtium apart in their support for OEM needs for demanding applications, early-to-market technology, legacy product and technical support. The new website also shows how Virtium allows open access to its highly experienced engineering team and its enhanced product management and control resources.
Virtium’s engineering senior management has played a leading role in the development of the new RS-DIMM Rugged Memory Specification for the Small Form Factor Special Interest Group (SFF-SIG). RS-DIMM was developed to help designers meet excessive shock and vibration requirements, and the specification defines a highly rugged DDR3 memory module for use with small form factor embedded computing boards such PC/104, ETX, COM Express, AdvancedMCs and other embedded small form factors for the telecommunication, mil/aero and industrial markets.
Matching the new SFF-SIG Specification, Virtium also released its 4GB DDR3 Unbuffered RS-DIMM module. The availability of Virtium’s new 4GB DDR3 Unbuffered RS-DIMM module demonstrates that the Specification is ready for full adoption and can be immediately used to meet rugged application demands for memory.
Virtium Announces its new 8GB DDR3 VLP Registered DIMM using 2Gbit Non-Stack Components
Virtium announced its new 8 gigabyte (GB) DDR3 Registered DIMM in the Very-Low Profile (VLP). Virtium’s new 8GB VLP Registered DIMM module has a height of only 18.3mm (0.72 inches) and measures a minimal 3.57mm (0.140 inches) thick. It has been innovatively designed using mainstream 2Gbit DDR3 DRAM monolithic package non-stacked components that meet a broad range of high density, smaller size and lower cost memory application requirements. Using Virtium’s breakthrough layout technique, customers realize increased reliability and the design advantages of a greatly reduced module thickness that enables increased airflow through the components and throughout the system. The Virtium 8GB VLP Registered DIMM is an excellent solution for current and next-generation embedded OEM and telecommunications applications such as storage blade servers, AdvancedTCA blades, Ethernet switches and routers.
Virtium Awarded Patent for Industry’s First Dual Function Memory Module
Virtium has been awarded a new patent for its dual function memory module known as SSDDR. The patent represents an industry first that combines solid state storage and DDR SDRAM technologies into a single, space-saving module. Conforming to industry-accepted DIMM and SODIMM form factors, Virtium’s SSDDR integrates Serial ATA Solid State Drive (SATA SSD) and Double Data Rate Synchronous Dynamic Ram (DDR SDRAM) technologies into a single SODIMM socket. This technology is an optimal solution for Single Board Computers (SBCs), ETX, COM Express and AdvancedTCA applications.
Virtium’s SSDDR is an innovative approach to solving storage design challenges facing embedded OEM designers in network/telecom, medical, gaming and military markets. SATA SSDs have not been available in the form factors required for embedded applications. Virtium’s SSDDR fills the void with localized SATA SSD storage for embedded operating systems coupled with main CPU memory provided by the DDR SDRAM. Designers save valuable board space and more easily meet rigorous requirements for reduced power consumption for rugged, mission-critical applications.
Demonstrating the company’s long history of supplying customers first-to-market memory module solutions, Virtium has released its 4 GB DDR3 Registered Mini-DIMM in the Very-Low Profile (VLP) 0.72-inch form factor that features a minimal of 0.140-inch or 3.56mm module thickness. The module is innovatively designed using mainstream 2Gbit DDR3 DRAM monolithic package components that meet customer needs for high density, smaller size and lower cost modules. Matching higher system reliability requirements, Virtium has applied a new layout technique that reduces the module’s overall thickness and enables greater airflow through the components and throughout the system. An optimal solution for a broad range of high availability and critical system applications in the network and telecommunications markets, the Virtium 4 GB DDR3 VLP Mini-DIMM is particularly suited for AdvancedTCA blades, PCI Express RAID cards, Ethernet switches and routers.
Virtium Technology continues its commitment to quality by successfully passing the ISO9001:2000 and AS9100 Rev. B annual surveillance audit of its Quality Management System. Meeting higher quality requirements, the company’s certification is now upgraded to ISO9001:2008, the latest quality management system revision of the ISO9001 standard. Virtium’s long-term success and stable OEM partnerships are a testament to its 14-year focus of making quality a strategic corporate mission.
Virtium Technology maintains its strong upward revenue trend, which began in January 2010. The company has posted record revenue increases for the third quarter 2010. Virtium executives contribute its fiscal success to its high level services and extended memory module portfolio that deliver added performance and functionality. Exceeding customer requirements, Virtium’s enhanced capabilities include 100 percent industrial temperature screening (-40C – +85 degree C), conformal coating and advanced thermal management methodologies for rugged environments as well as screening for extended Vref signal margins to achieve maximum system reliability.
Virtium Technology announces the industry’s first 4GB DDR3 ECC UNBUFFERED Mini-DIMM available in its Ultra-Low Profile (ULP) 0.700-inch form factor. The new DDR3 memory module is an enhanced VLP MiniDIMM design that uses mainstream 2Gbit DDR3 DRAM monolithic package components and features a minimal 0.140-inch/3.56mm module thickness. Virtium’s 4GB DDR3 ULP is an optimal solution for wide range of space-constrained embedded systems that require reliable high-speed computing performance and low power.