Milestones

Founded in 1997, Virtium has become an industry leader with a history of design innovation, superior service and company stability.  Achievements from Virtium include the awarding of a number of technology patents, the ability to consistently deliver new products to market early and maintain some of the longest product life cycles within the industry.

2010

• Expanded into the flash storage market
• Awarded U.S. Patent 7762818 for Multi Function Module
  
• Awarded U.S. Patent 7786563 for Stacking Multiple Devices using Single-Piece Interconnect Element
  
• Invented 2Gbit High Density Memory Components with innovative side-by-side placement
  
• Became a member of the SFF-SIG

 

2009

 

• Obtained AS9100 Certification
• First to market with DDR3 SO-UDIMM
  
• Became a member of the Intel Embedded Alliance

2008

• Awarded U.S. Patent 6566610 – Stacking Multiple Devices using Direct Soldering
• Expanded R&D and Design Centers in Vietnam
  
• Invented multi-function SODIMM (SATA flash storage and DDR DRAM memory)
  
• Became a member of MEPTEC
  
• Became a member of the SATA-IO International Organization

2007

• Received U.S. Patent 7167373 for Stacking Multiple Devices using Flexible Circuit
• Invented Method of Stacking BGA Component using direct soldering technique.
• Received GE Energy’s Preferred Supplier Quality Award
  
• Received JEDEC’s Certificate of Appreciation Award
  
• Became a RadiSys Approved Vendor
• Invented AMC flash storage card for AdvancedTCA-based platforms
  
• First to market with 0.70-in. VLP DIMM for AdvancedTCA
• Launched Rampedia.com, an online DRAM memory encyclopedia and reference tool
  

2006

• Became one of Kontron’s top five suppliers, winning the company’s Outstanding Quality Performance Award   

2005

• Received Excellence in Cost Savings Award from Emerson Network Power
• Became a member of the California Manufacturers and Technology Association
  

2004

• Invented method for stacking multiple BGA devices using flexible circuit   
• Received Excellence in Technical Support Award from Emerson Network Power
  
• Invented and first to market with DDR2 ECC Registered SODIMM
  

2003

• Named to Inc. Magazine’s List of Top 500 Fastest Growing Private Companies
• Awarded U.S. Patent 6566610 for Stacking Multiple Devices using Direct Soldering
  

2002

• Became a member of SMTA

2001

• Awarded ISO9000 certification
• Became a member of PICMG
  

2000

• Invented CompactRAM stacked board solution for CompactPCI designs    

1999

• Invented the TSOP chip stack

1998

• Became a member of JEDEC
• Became a member of IPC
  

1997

• Virtium founded