News
February 8, 2012
Virtium Technology, Inc., a leading provider of storage and memory solutions for embedded systems, has named Gary Drossel its Vice President of Product Strategy. Drossel is responsible for developing Virtium’s product strategies and executing them through the management of the company’s memory and solid-state drive (SSD) product portfolio. In this strategic role, Drossel will also align the product roadmap to the market-driven needs of Virtium’s customers.
October 2011
Virtium’s new and revolutionary locking devices allows Industrial OEM Manufacturer’s to enhance the ruggedized performance of DIMM, SO-DIMM, UDIMM, SDRAM SO-DIMM, SORDIMM, and CDIMM industrial memory modules in applications with no physical alterations to Motherboard or Memory Modules.
Virtium continues to provide innovative and reliable solutions in Ruggedized Applications for Industrial Embedded and Telecommunications OEMs. Engineers and product specialists at Virtium are proud to announce a newly developed and highly effective locking device technology for use with various industrial SO-DIMM, ECC SODIMM, DIMM and Mini DIMM modules in rugged application designs. This leading-edge technology has evolved through Virtium’s continuous approach to providing solutions that help to overcome harsh environment and vibration challenges faced by Industrial memory OEMs.
September 2011
Virtium introduces new Industrial CF (Compact Flash) for OEMs.
Virtium Tuffdisk™ VCF400 Compact Flash Solution extends product life cycle support for Industrial OEMs.
(September 15, 2011) Rancho Santa Margarita, CA. Virtium Technology, Inc.,a solutions driven-designer and manufacturer of Industrial Memory and Flash Storage Solutions for Embedded and Communication OEMs, announced its newly developed and highly efficient Compact Flash Solution supporting large page flash for NAND technology. This will serve to extend the Compact Flash form factor life cycle by seven more years in Industrial Embedded and Communication applications.
August 2011
Virtium Technology Inc., a solutions driven-designer and manufacturer of industrial memory and flash storage solutions for embedded and communication OEMs is sponsoring the Annual Flash Memory Summit, taking place from August 8th-11th 2011 in Santa Clara, CA.
June 2011
Virtium Announces new Low Power DDR3 VLP Unbuffered DIMM Series New 1.35V VLP U-DIMM module provides a 43% reduction in power consumption that helps OEMs meet energy saving system requirements
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April 2011
Virtium Introduces New Line of TuffDisk Flash Solutions
Virtium introduced a comprehensive new line of standard and industrial temperature Flash solutions, designated TuffDisk. An expansion of Virtium’s DRAM offering, the new TuffDisk line is optimized for the high reliability and endurance needs of a wide variety of embedded OEM military-aerospace, networking-telecommunications, medical, storage server and gaming applications. Tuffdisk integrates SLC NAND Flash coupled with advanced wear leveling algorithms that ensure its endurance meets a minimum of 2M write/erase cycles. Virtium’s new Flash solutions also meet a broad range of embedded OEM application goals including long product life, cost, high speed, compatibility and low power. The line of Tuffdisk products support PATA, SATA, USB, and SD with form factors embracing industrial OEM proven packaging standards of SSDs, SD Cards, eUSB, SD, CF, CFast, mSATA, SlimSATA, amongst others.
What sets the new TuffDisk products apart, is Virtium’s enhanced product support and extended product life management. Virtum offers its extended support to overcome OEM concerns regarding ongoing NAND Flash die shrinkage and regular controller firmware changes that can cause significant system incompatibility issues for Flash storage users. That is why Virtium, as part of its service offering, will work closely with customers to define a test environment that will guarantee compatibility. Virtium will then use a customer’s approved test method throughout its production process on either the customer’s actual hardware or hardware that has been approved.
March 2011
Virtium Launches New Website
Virtium has launched a new website to better serve the informational and product support needs of its customers. The new website features an enhanced graphical look and updated navigation enabling users to quickly find a specific Virtium memory or Flash solution datasheet. Virtium’s new website also provides increased content about the company’s extensive capabilities that include supply chain management, manufacturing, testing and quality assurance.
Virtium’s OEM customers in the embedded computing, telecommunications, networking, storage, military, infotainment and medical markets now can learn additional details about Virtium’s collaborative customer approach. This approach is what sets Virtium apart in their support for OEM needs for demanding applications, early-to-market technology, legacy product and technical support. The new website also shows how Virtium allows open access to its highly experienced engineering team and its enhanced product management and control resources.
February 2011
Virtium Leads Working Group Development of Rugged Small Form Factor DIMM SFF-SIG Standard
Virtium’s engineering senior management has played a leading role in the development of the new RS-DIMM Rugged Memory Specification for the Small Form Factor Special Interest Group (SFF-SIG). RS-DIMM was developed to help designers meet excessive shock and vibration requirements, and the specification defines a highly rugged DDR3 memory module for use with small form factor embedded computing boards such PC/104, ETX, COM Express, AdvancedMCs and other embedded small form factors for the telecommunication, mil/aero and industrial markets.
Matching the new SFF-SIG Specification, Virtium also released its 4GB DDR3 Unbuffered RS-DIMM module. The availability of Virtium’s new 4GB DDR3 Unbuffered RS-DIMM module demonstrates that the Specification is ready for full adoption and can be immediately used to meet rugged application demands for memory.
January 2011
Virtium Announces its new 8GB DDR3 VLP Registered DIMM using 2Gbit Non-Stack Components
Virtium announced its new 8 gigabyte (GB) DDR3 Registered DIMM in the Very-Low Profile (VLP). Virtium’s new 8GB VLP Registered DIMM module has a height of only 18.3mm (0.72 inches) and measures a minimal 3.57mm (0.140 inches) thick. It has been innovatively designed using mainstream 2Gbit DDR3 DRAM monolithic package non-stacked components that meet a broad range of high density, smaller size and lower cost memory application requirements. Using Virtium’s breakthrough layout technique, customers realize increased reliability and the design advantages of a greatly reduced module thickness that enables increased airflow through the components and throughout the system. The Virtium 8GB VLP Registered DIMM is an excellent solution for current and next-generation embedded OEM and telecommunications applications such as storage blade servers, AdvancedTCA blades, Ethernet switches and routers.
November 2010
Virtium Awarded Patent for Industry’s First Dual Function Memory Module
Virtium has been awarded a new patent for its dual function memory module known as SSDDR. The patent represents an industry first that combines solid state storage and DDR SDRAM technologies into a single, space-saving module. Conforming to industry-accepted DIMM and SODIMM form factors, Virtium’s SSDDR integrates Serial ATA Solid State Drive (SATA SSD) and Double Data Rate Synchronous Dynamic Ram (DDR SDRAM) technologies into a single SODIMM socket. This technology is an optimal solution for Single Board Computers (SBCs), ETX, COM Express and AdvancedTCA applications.
Virtium’s SSDDR is an innovative approach to solving storage design challenges facing embedded OEM designers in network/telecom, medical, gaming and military markets. SATA SSDs have not been available in the form factors required for embedded applications. Virtium’s SSDDR fills the void with localized SATA SSD storage for embedded operating systems coupled with main CPU memory provided by the DDR SDRAM. Designers save valuable board space and more easily meet rigorous requirements for reduced power consumption for rugged, mission-critical applications.
October 2010
Demonstrating the company’s long history of supplying customers first-to-market memory module solutions, Virtium has released its 4 GB DDR3 Registered Mini-DIMM in the Very-Low Profile (VLP) 0.72-inch form factor that features a minimal of 0.140-inch or 3.56mm module thickness. The module is innovatively designed using mainstream 2Gbit DDR3 DRAM monolithic package components that meet customer needs for high density, smaller size and lower cost modules. Matching higher system reliability requirements, Virtium has applied a new layout technique that reduces the module’s overall thickness and enables greater airflow through the components and throughout the system. An optimal solution for a broad range of high availability and critical system applications in the network and telecommunications markets, the Virtium 4 GB DDR3 VLP Mini-DIMM is particularly suited for AdvancedTCA blades, PCI Express RAID cards, Ethernet switches and routers.
September 2010
Virtium Technology continues its commitment to quality by successfully passing the ISO9001:2000 and AS9100 Rev. B annual surveillance audit of its Quality Management System. Meeting higher quality requirements, the company’s certification is now upgraded to ISO9001:2008, the latest quality management system revision of the ISO9001 standard. Virtium’s long-term success and stable OEM partnerships are a testament to its 14-year focus of making quality a strategic corporate mission.
August 2010
Virtium Technology maintains its strong upward revenue trend, which began in January 2010. The company has posted record revenue increases for the third quarter 2010. Virtium executives contribute its fiscal success to its high level services and extended memory module portfolio that deliver added performance and functionality. Exceeding customer requirements, Virtium’s enhanced capabilities include 100 percent industrial temperature screening (-40C – +85 degree C), conformal coating and advanced thermal management methodologies for rugged environments as well as screening for extended Vref signal margins to achieve maximum system reliability.
July 2010
Virtium Technology announces the industry’s first 4GB DDR3 ECC UNBUFFERED Mini-DIMM available in its Ultra-Low Profile (ULP) 0.700-inch form factor. The new DDR3 memory module is an enhanced VLP MiniDIMM design that uses mainstream 2Gbit DDR3 DRAM monolithic package components and features a minimal 0.140-inch/3.56mm module thickness. Virtium’s 4GB DDR3 ULP is an optimal solution for wide range of space-constrained embedded systems that require reliable high-speed computing performance and low power.
