Manufacturing Capabilities
All Virtium manufacturing facilities have constant close supervision of the entire manufacturing process to ensure maximum quality for our customers. Virtium operates multiple in-house SMT manufacturing lines in the U.S. with significant expansion capabilities to triple our current manufacturing capacity. We also have high-quality overseas manufacturing capabilities for additional volume production.
Virtium’s world-class manufacturing organization offers the following capabilities:
- Flexible manufacturing with the ability to change production set up and other specific parameters quickly per customer requirements. Virtium’s agile manufacturing organization allows for fast changes to volume and delivery giving our customers the ability to push in or push out their schedule within a day’s notice
- A dedicated prototype line enables us to quickly build evaluation units to promptly support customer changes helping them qualify and meet their dynamic schedule demands
- Advanced equipment includes 3D solder paste inspection, automatic optical inspection and X-ray equipment for BGA inspection
- Ability to satisfy customer requirements for environmentally-friendly, lead-free manufacturing
Virtium also has full in-house manufacturing capabilities for product enhancements such as:
- High volume BGA, TSOP stacking
- Industrial temperature screening
- Conformal coating
- Underfilled components
- Customized heat sink applications
Virtium’s manufacturing facilities are certified to ISO-9001 and AS-9100 standards. Virtium’s manufacturing practice complies with IPC-610 Class 2 and Class 3 PCB assembly standards.
Virtium’s advanced manufacturing capabilities include:
X-Ray
Virtium’s X-ray capability is used to inspect products for voids in die-attach and to inspect BGA solder joints that cannot be visibly accessed. Virtium’s manufacturing procedures define a test plan for representative members of each production lot to receive X-ray inspection. X-ray inspection is an example of the extra value Virtium delivers to ensure quality products, and is part of our data-driven quality improvement process.
3D Solder Paste Inspection (SPI)
Virtium understands that quality at the start of the SMT process comes from improving the quality of solder paste printing. Virtium’s three-dimensional solder paste inspection (SPI) system quickly measures the area, volume, and thickness of every solder placement, and can additionally detect short circuits. Our 3-D solder inspection reduces the failure potential of tiny SMT products, preventing them from forming weak connections. Without pre-reflow solder inspection, small solder joints and lack of solder, combined with component vibrations and heat expansion create the potential for long-term reliability issues. The use of SPI demonstrates Virtium’s commitment to increasing our delivered quality levels using data-driven processes.
Advanced Optical Inspection
Advanced optical inspection checks for a wide variety of potential manufacturing defects including scratches and stains, open circuits, short circuits, thinning solder, component markings and component orientation after the reflow process is completed. This inspection augments Virtium’s after reflow inspection, and is performed on a 100% of our products by an experienced Virtium technician. Automated visual inspection provides the advantage of delivering consistent quality through a non-contact test method that is a strong complement to people-based inspection systems.
