Engineering Capabilities

Virtium’s leading position in the memory industry is supported by the company’s strong engineering expertise that has lead to a long list of industry-first products and is accompanied by our enduring commitment to be last out with legacy products.  

Recognized as a world-class solution provider, members of the Virtium engineering team are experts in the development of high performance, high reliability memory and flash products.  The team has a proven history of pioneering multiple next-generation memory and flash storage technologies.  Virtium  engineering is also responsible for ground-breaking development of compact form factors that include Mini-DIMM, Micro-DIMM, SO-DIMM, VLP, ULP, SSDDR and other stacked or space-saving technologies and special features such as ECC, non-conformance coating and high temperature tolerance.  Plus, the engineering management at Virtium continually takes leading roles in JEDEC, PICMG and SFF-SIG standards communities, which results in first-to-market products.

At Virtium, customer service is our highest priority.  We have established close working relationships with many Fortune 500 companies that benefit from an assigned team of dedicated engineers, FAEs and program managers that work collaboratively to provide real-time review of industry trends and “best choice” designs for their specific projects.  This innovative and flexible team adds value and streamlines the design process with:

• Comprehensive pre-design simulation, thermal analysis, system design timing analysis with the use of Cadence and SiSoft tool sets
• Fast response to special feature and custom design requests
• Custom testing capabilities that meet unique requirements
  
• Convergence design between memory and flash storage
  
• The ability to help focus on future designs by offering excellent technical support to customer’s design and business development teams
  
• Superior “Quick turn” response to design layout and prototype support through provision of:
  
  • Concept specifications
    
  • Mechanical drawings
    
  • Data sheets
    
  • Evaluation units
    
• Our assurance to be “First In” and “Last Out” with products for the duration of a customer’s project
  

Virtium maintains strong partnerships with leading chip set manufacturers that allow us early access to design and validate next-generation memory form factors.  This also enables Virtium designers prioritize and focus on offering multiple DRAM brand options to enhance performance that also protects customers from supply chain shortages.  

We also understand our customers cost constraints and always look to use reasonably-priced, but high-quality components when creating our superior products.  An example of our ingenuity is the utilization of cost-effective 1 Gb components in our new 8 GB DDR3 memory modules.

Our first-to-market achievements and patents demonstrate our leading memory module engineering expertise:

Milestones

• 2010 — Awarded U.S. Patent 7762818 for Multi Function Module
• 2010 — Awarded U.S. Patent 7786563 for Stacking Multiple Devices
  
• 2010 — Invented 2Gb High Density Memory Components with innovative side-by-side placement
  
• 2009 –- First-to-market with DDR3 SO-UDIMM
  
• 2008 — Awarded U.S. Patent 6566610 – Stacking Multiple Devices using Direct Soldering
  
• 2007 — First to market with 0.70-in. VLP DIMM for AdvancedTCA 

For additional information about Virtium’s world-class capabilities, please go to: quality, testing, and manufacturing pages.