New and revolutionary locking devices allow Industrial OEM’s to enhance the ruggedized performance of DIMM, SO-DIMM, UDIMM, SDRAM SO-DIMM, SORDIMM, and CDIMM industrial memory modules with no physical alterations to Motherboard or Memory Modules.
Virtium continues to provide innovative and reliable solutions in Ruggedized Applications for Industrial Embedded and Telecommunications OEMs. Engineers and product specialists at Virtium are proud to announce a newly developed and highly effective locking device technology for use with various industrial SO-DIMM, ECC SODIMM, DIMM and Mini DIMM modules in rugged application designs. This leading-edge technology has evolved through Virtium’s continuous approach to providing solutions that help to overcome harsh environment and vibration challenges faced by Industrial memory OEMs.


The new VLP DDR3-1600 Registered DIMM ( VLP RDIMM) module features 2Gbit monolithic components, 8GB denisty, and very low profile module height designed for a broad range of telecommunication and networking applications. Virtium’s high density 8GB dual rank module utilizes x4 2Gbit DRAM monolithic components in the JEDEC standard pin-out and VLP module height of 18.29 mm (.72 inches).



